Gen-Z 4C+ 168P Receptacle STR to 2 MCIO 8X EDSFF Cable

The Gen-Z 4C+ 168P Receptacle STR to 2 MCIO 8X Cable is a high-performance interface conversion solution designed for next-generation data center and server applications. This cable assembly features a Gen-Z 4C+ 168-position straight receptacle connector on one end and two MCIO 8X connectors on the other end, providing seamless connectivity between Gen-Z infrastructure and MCIO-based devices. Engineered for exceptional signal integrity and power delivery, this cable supports the latest high-speed protocols while enabling flexible system design in enterprise environments, AI servers, and high-performance computing applications.

Features

• High-Speed Interface Conversion: Connects Gen-Z 4C+ 168P receptacles to dual MCIO 8X interfaces
• Exceptional Bandwidth Support: Designed for Gen-Z protocols with support for future PCIe generations
• Enhanced Power Delivery: 4C+ configuration supports up to 80W power delivery through 12V main power and 3.3V Vaux
• Superior Signal Integrity: Optimized impedance matching and shielding for minimal signal degradation
• Robust Construction: Durable materials ensure reliability in demanding data center environments
• Hot-Swap Capable: Designed to support hot-swap operations for enterprise applications
• Standard Compliance: Fully complies with SFF-TA-1002 and Gen-Z specifications
• Flexible System Design: Enables building block architecture for connecting different function PCBs

Specifications

• Host Connector: Gen-Z 4C+ 168P Receptacle STR (Straight)
• Device Connectors: 2x MCIO 8X (74-position each)
• Data Rate Support: Up to 56 GT/s PAM4 (Gen-Z), 32 GT/s (PCIe 5.0)
• Supported Protocols: Gen-Z, PCIe 5.0/4.0, SAS4 (24Gbps)
• Power Delivery: 12V main power (up to 80W) + 3.3V Vaux power
• Cable Length: 1.0m
• Operating Temperature: -40°C to +85°C
• Durability Rating: 2,500+ mating cycles
• Impedance: 85? ±5% (differential)
• Shielding: Individual pair shielding with overall braid protection
• Contact Plating: Gold-plated contacts (15?" minimum)
• Dielectric Withstanding Voltage: 300VDC

Applications

• AI Server Infrastructure: Connecting Gen-Z memory controllers to peripheral devices
• High-Performance Computing: Enabling flexible system architecture in computational clusters
• Data Center Storage: Facilitating high-speed connections between storage controllers and drives
• OCP Compliance Systems: Ideal for Open Common Server Platform implementations
• Enterprise Storage Arrays: Supporting high-bandwidth storage solutions
• Server Backplane Connections: CPU to backplane and CPU to NIC card applications
• Edge Computing Infrastructure: Space-constrained high-performance computing environments
• Research and Development: Testing and validation of Gen-Z and PCIe 5.0/6.0 technologies

Compatibility Notes

This cable is specifically designed for Gen-Z 4C+ infrastructure and requires compatible MCIO 8X devices. The 4C+ configuration includes additional pins for Open Compute Project (OCP) mezzanine NIC applications specific to edge band and management. Ensure proper system compatibility before installation, as the Gen-Z 4C+ connector supports higher power delivery capabilities compared to standard 4C configurations. The cable maintains signal integrity for high-speed data transmission but does not convert between different protocols. This solution is particularly valuable in environments implementing building block architecture for connecting different function PCBs. Verify power requirements and thermal considerations for specific application scenarios, especially in high-density server configurations.