Gen-Z 4C+ 168P R/A To Gen-Z 4C+ 168P R/A EDSFF Cable

The Gen-Z 4C+ 168P R/A to Gen-Z 4C+ 168P R/A EDSFF Cable is a high-performance passive copper cable assembly designed for next-generation data center and enterprise storage applications. This cable features identical Gen-Z 4C+ 168-position right-angle (R/A) connectors on both ends, providing seamless connectivity between Gen-Z 4C+ compatible devices while specifically optimized for EDSFF (Enterprise and Data Center SSD Form Factor) environments. Engineered for exceptional signal integrity and power delivery, this cable supports the latest high-speed protocols while enabling flexible system design in enterprise storage arrays, AI servers, and high-performance computing applications requiring EDSFF compatibility.  

Features  

• High-Speed Connectivity: Provides full Gen-Z 4C+ 168P R/A to R/A connectivity with EDSFF optimization  
• Right-Angle Design: Space-saving right-angle connectors enable efficient cable routing in tight spaces  
• Exceptional Bandwidth Support: Designed for Gen-Z protocols with support for PCIe 5.0/4.0 and SAS4  
• Enhanced Power Delivery: 4C+ configuration supports up to 80W power delivery (12V main + 3.3V Vaux)  
• Superior Signal Integrity: Optimized impedance matching and shielding for minimal signal degradation  
• EDSFF Compatibility: Specifically tailored for Enterprise and Data Center SSD Form Factor applications  
• Robust Construction: Durable materials ensure reliability in demanding data center environments  
• Hot-Swap Capable: Designed to support hot-swap operations for enterprise applications  

Specifications  

• Host Connector: Gen-Z 4C+ 168P Right-Angle (R/A)  
• Device Connector: Gen-Z 4C+ 168P Right-Angle (R/A)  
• Data Rate Support: Up to 56 GT/s PAM4 (Gen-Z), 32 GT/s NRZ (PCIe 5.0)  
• Supported Protocols: Gen-Z, PCIe 5.0/4.0, SAS4 (24Gbps)  
• Power Delivery: 12V main power (up to 80W) + 3.3V Vaux power  
• Cable Length: 1.0m 
• Operating Temperature: -40°C to +85°C  
• Durability Rating: 2,500+ mating cycles  
• Impedance: 85? ±5% (differential)  
• Shielding: Individual pair shielding with overall braid protection  
• Contact Plating: Gold-plated contacts (15?" minimum)  
• Dielectric Withstanding Voltage: 300VDC  
• Connector Pitch: 0.6mm  

Applications  

• EDSFF Storage Arrays: Connecting EDSFF solid-state drives in enterprise storage configurations  
• AI Server Infrastructure: High-speed connections between Gen-Z memory controllers and EDSFF storage devices  
• High-Performance Computing: Enabling flexible system architecture in computational clusters with EDSFF compatibility  
• Data Center Storage: Facilitating high-speed connections between storage controllers and EDSFF drives  
• Enterprise Storage Solutions: Supporting high-bandwidth storage solutions with EDSFF form factor  
• Server Backplane Connections: CPU to backplane and CPU to storage card applications  
• OCP Compliance Systems: Ideal for Open Common Server Platform implementations with EDSFF support  
• Research and Development: Testing and validation of Gen-Z and EDSFF technologies  

Compatibility Notes  

This cable is specifically designed for Gen-Z 4C+ infrastructure and requires compatible Gen-Z 4C+ devices with EDSFF support. The 4C+ configuration includes additional pins for Open Compute Project (OCP) mezzanine NIC applications specific to edge band and management. Ensure proper system compatibility before installation, as the Gen-Z 4C+ connector supports higher power delivery capabilities compared to standard 4C configurations. The cable maintains signal integrity for high-speed data transmission but does not convert between different protocols. This solution is particularly valuable in environments implementing EDSFF form factor devices and building block architecture for connecting different function PCBs. Verify power requirements and thermal considerations for specific application scenarios, especially in high-density server configurations with EDSFF drives. The right-angle connector configuration is ideal for applications where horizontal space conservation is critical and vertical connection space is limited.