Gen-Z 1C 56P RSE To Gen-Z 1C 56P RSE EDSFF Cable

The Gen-Z 1C 56P RSE To Gen-Z 1C 56P RSE EDSFF Cable is a high-performance external cable assembly designed for next-generation data center and enterprise storage environments. This cable provides a reliable RSE (Right Side Exit) to RSE connection between devices equipped with Gen-Z 1C 56-pin interfaces, specifically optimized for EDSFF (Enterprise and Data Center SSD Form Factor) applications. Engineered to support high-speed data transfer protocols and integrated power delivery, this solution enables efficient connectivity between Gen-Z-based hosts and EDSFF storage devices while maximizing signal integrity, space utilization, and thermal performance in demanding storage configurations. The RSE connector design offers a raised stack height compared to standard options, providing additional clearance for complex routing scenarios in high-density servers.

Features

• RSE Connector Design: Features Right Side Exit (RSE) connectors on both ends, providing increased vertical clearance ideal for high-density server and storage environments where complex cable routing is required, particularly in EDSFF form factors (e.g., E1.S, E1.L, E3.S).
• High-Speed Data Support: Supports data transfer rates up to 56 GT/s (PAM4) or 32 GT/s (NRZ), complying with Gen-Z and PCIe 5.0/6.0 specifications, ensuring compatibility with high-bandwidth applications like all-flash arrays, computational storage, and AI/ML workloads.
• Integrated Power Delivery: Combines high-speed data lines with power delivery within the same connector, supporting up to 80W of power (12V main and 3.3V auxiliary) as per Gen-Z 1C specifications, eliminating the need for separate power cables and simplifying system design.
• Enhanced Signal Integrity: Utilizes precision-engineered twin-axial copper or active optical cables with multi-layer shielding (foil and braid) to minimize insertion loss, crosstalk, and electromagnetic interference (EMI), ensuring stable data transmission at high speeds over distances up to 10m (for AOC variants).
• EDSFF Optimization: Specifically tailored for EDSFF form factors, providing mechanical and electrical compatibility with emerging SSD standards in data centers, including hot-swap support and robust latching mechanisms for vibration-prone environments.
• Thermal Management: The RSE design balances increased stack height with thermal efficiency in densely packed systems, operating reliably within temperature ranges of 0°C to +70°C (commercial) or -40°C to +85°C (industrial options).

Specifications

• Product Model: Gen-Z 1C 56P RSE To Gen-Z 1C 56P RSE EDSFF Cable
• Connector A: Gen-Z 1C, 56-Position, Male, RSE (Right Side Exit)
• Connector B: Gen-Z 1C, 56-Position, Male, RSE (Right Side Exit)
• Connector Gender: Male to Male
• Cable Type: External Active Optical Cable (AOC) or Passive Copper Cable
• Cable Length: Standard options: 0.5m, 1.0m, 2.0m (Custom lengths up to 10m for AOC variants)
• Data Rate Support: Up to 56 GT/s (PAM4), 32 GT/s (NRZ)
• Supported Protocols: Gen-Z, PCI Express (PCIe) 5.0/6.0, NVMe over Fabrics (NVMe-oF), CXL 3.1
• Power Delivery: Up to 80W (12V main + 3.3V auxiliary)
• Impedance: 85 Ohms (differential)
• Shielding: Foil and braid shielding for EMI protection
• Operating Temperature: 0°C to +70°C (commercial); -40°C to +85°C (industrial options)
• Durability: Minimum 1,000 insertion cycles
• Safety Standards: RoHS compliant, UL-approved components

Applications

• EDSFF Storage Arrays: Connecting Gen-Z hosts or switches to EDSFF SSDs in all-flash storage arrays, enabling high-speed data access, scalability, and composability in hyperscale data centers and cloud environments.
• High-Performance Computing (HPC): Supporting HPC clusters and AI/ML training servers that require low-latency, high-bandwidth connections between compute nodes and Gen-Z-based storage systems, particularly for memory-centric workloads.
• Data Center Infrastructure: Deploying in hyperscale data centers for flexible storage solutions that leverage Gen-Z's memory-semantic architecture, enabling efficient resource disaggregation and dynamic composability.
• AI/ML and Computational Storage: Facilitating high-throughput data pipelines for AI/ML applications and computational storage drives (CSDs) where EDSFF form factors and Gen-Z's low latency are critical for performance.
• Edge Computing and OCP Platforms: Ideal for edge storage deployments and Open Compute Project (OCP) designs that require compact, power-efficient connections with support for hot-swappable EDSFF modules.
• System Integration and Retrofitting: Enabling seamless integration of Gen-Z-enabled EDSFF devices into existing infrastructure, particularly where raised stack height is needed for clearance over other components.