Gen-Z 1C 56P STR To Gen-Z 1C 56P STR EDSFF Cable

The Gen-Z 1C 56P STR to Gen-Z 1C 56P STR Cable is a high-performance passive copper cable assembly designed for next-generation data center and server applications. This cable features identical Gen-Z 1C 56-position straight connectors on both ends, providing seamless connectivity between Gen-Z 1C compatible devices. Engineered for exceptional signal integrity and power delivery, this cable supports the latest high-speed protocols while enabling flexible system design in enterprise environments, AI servers, and high-performance computing applications. The straight connector design ensures optimal compatibility in various installation scenarios where vertical space is available.

Features

• High-Speed Connectivity: Provides full Gen-Z 1C 56P STR to 1C 56P STR connectivity
• Exceptional Bandwidth Support: Designed for Gen-Z protocols with support for future PCIe generations
• Enhanced Power Delivery: 1C configuration supports up to 80W power delivery through 12V main power and 3.3V Vaux
• Superior Signal Integrity: Optimized impedance matching and shielding for minimal signal degradation
• Robust Construction: Durable materials ensure reliability in demanding data center environments
• Hot-Swap Capable: Designed to support hot-swap operations for enterprise applications
• Standard Compliance: Fully complies with SFF-TA-1002 and Gen-Z specifications
• Flexible System Design: Enables building block architecture for connecting different function PCBs

Specifications

• Host Connector: Gen-Z 1C 56P STR (Straight)
• Device Connector: Gen-Z 1C 56P STR (Straight)
• Data Rate Support: Up to 56 GT/s PAM4 (Gen-Z), 32 GT/s (PCIe 5.0)
• Supported Protocols: Gen-Z, PCIe 5.0/4.0, SAS4 (24Gbps)
• Power Delivery: 12V main power (up to 80W) + 3.3V Vaux power
• Cable Length: Typically 0.5m, 0.7m, 1.0m (standard options)
• Operating Temperature: -40°C to +85°C
• Durability Rating: 2,500+ mating cycles
• Impedance: 85? ±5% (differential)
• Shielding: Individual pair shielding with overall braid protection
• Contact Plating: Gold-plated contacts (15?" minimum)
• Dielectric Withstanding Voltage: 300VDC
• Connector Pitch: 0.6mm

Applications

• AI Server Infrastructure: Connecting Gen-Z memory controllers to peripheral devices
• High-Performance Computing: Enabling flexible system architecture in computational clusters
• Data Center Storage: Facilitating high-speed connections between storage controllers and drives
• OCP Compliance Systems: Ideal for Open Common Server Platform implementations
• Enterprise Storage Arrays: Supporting high-bandwidth storage solutions
• Server Backplane Connections: CPU to backplane and CPU to NIC card applications
• Edge Computing Infrastructure: Space-constrained high-performance computing environments
• Research and Development: Testing and validation of Gen-Z and PCIe 5.0/6.0 technologies